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Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Insights, Forecast to 2028

Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Insights, Forecast to 2028

  • Category:Semiconductor and Electronics
  • Published on : 27 August 2022
  • Pages :109
  • Formats:
  • Report Code:SMR-7299083
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Threedimensional Integrated Circuit And ThroughSilicon Via Interconnect Market Size, Share 2022


Market Analysis and Insights: Global Threedimensional Integrated Circuit And ThroughSilicon Via Interconnect Market

The global Threedimensional Integrated Circuit And ThroughSilicon Via Interconnect market size is projected to reach US$ XX million by 2027, from US$ XX million in 2020, at a CAGR of XX% during 2021-2027.

With industry-standard accuracy in analysis and high data integrity, the report makes a brilliant attempt to unveil key opportunities available in the global Threedimensional Integrated Circuit And ThroughSilicon Via Interconnect market to help players in achieving a strong market position. Buyers of the report can access verified and reliable market forecasts, including those for the overall size of the global Threedimensional Integrated Circuit And ThroughSilicon Via Interconnect market in terms of revenue.

On the whole, the report proves to be an effective tool that players can use to gain a competitive edge over their competitors and ensure lasting success in the global Threedimensional Integrated Circuit And ThroughSilicon Via Interconnect market. All of the findings, data, and information provided in the report are validated and revalidated with the help of trustworthy sources. The analysts who have authored the report took a unique and industry-best research and analysis approach for an in-depth study of the global Threedimensional Integrated Circuit And ThroughSilicon Via Interconnect market.

Global Threedimensional Integrated Circuit And ThroughSilicon Via Interconnect Scope and Market Size

Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect market is segmented by players, region (country), by Type and by Application. Players, stakeholders, and other participants in the global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application for the period 2017-2028.

Segment by Type

Memories

Sensors

LEDs

Others

Segment by Application

Military

Aerospace and Defense

Consumer Electronics

Automotive

Others

By Company

Amkor Technology

Elpida Memory

Intel Corporation

Micron Technology Inc.

MonolithIC 3D Inc.

Renesas Electronics Corporation

Sony

Samsung Electronics

IBM

Qualcomm

STMicroelectronics

Texas Instruments

By Region

North America

United States

Canada

Europe

Germany

France

UK

Italy

Russia

Nordic Countries

Rest of Europe

Asia-Pacific

China

Japan

South Korea

Southeast Asia

India

Australia

Rest of Asia

Latin America

Mexico

Brazil

Rest of Latin America

Middle East & Africa

Turkey

Saudi Arabia

UAE

Rest of MEA

The information for each competitor/Company Profile includes:

  • Company Overview
  • Business Strategy
  • Key Product Offerings
  • Financial Performance
  • Key Performance Indicators
  • Risk Analysis
  • Recent Development
  • Regional Presence
  • SWOT Analysis 

The content of the study subjects includes a total of 15 chapters:

Chapter 1, describes Threedimensional Integrated Circuit And ThroughSilicon Via Interconnect product scope, market overview, market opportunities, market driving force, and market risks.

Chapter 2, profiles the top manufacturers of Threedimensional Integrated Circuit And ThroughSilicon Via Interconnect, with price, sales, revenue, and global market share of Threedimensional Integrated Circuit And ThroughSilicon Via Interconnect from 2019 to 2022.

Chapter 3, the Threedimensional Integrated Circuit And ThroughSilicon Via Interconnect competitive situation, sales, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Threedimensional Integrated Circuit And ThroughSilicon Via Interconnect breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2017 to 2028.

Chapters 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, and application, from 2017 to 2028.

Chapters 7, 8, 9, 10, and 11, to break the sales data at the country level, with sales, revenue, and market share for key countries in the world, from 2017 to 2022. and the Threedimensional Integrated Circuit And ThroughSilicon Via Interconnect market forecast, by regions, type, and application, with sales and revenue, from 2023 to 2028.

Chapter 12, the key raw materials and key suppliers, and industry chain of Threedimensional Integrated Circuit And ThroughSilicon Via Interconnect.

Chapter 13, 14, and 15, to describe Threedimensional Integrated Circuit And ThroughSilicon Via Interconnect sales channel, distributors, customers, research findings and conclusion, appendix and data source.

Key Indicators Analysed:

  • Market Players & Competitor Analysis: The report covers the key players of the industry including Company Profile, Product Specifications, Production Capacity/Sales, Revenue, Price and Gross Margin 2016-2027 & Sales with a thorough analysis of the market?s competitive landscape and detailed information on vendors and comprehensive details of factors that will challenge the growth of major market vendors.
  • Global and Regional Market Analysis: The report includes Global & Regional market status and outlook 2016-2027. Further the report provides break down details about each region & countries covered in the report. Identifying its sales, sales volume & revenue forecast. With detailed analysis by types and applications.
  • Market Trends: Market key trends which include Increased Competition and Continuous Innovations.
  • Opportunities and Drivers: Identifying the Growing Demands and New Technology
  • Porters Five Force Analysis: The report provides with the state of competition in industry depending on five basic forces: threat of new entrants, bargaining power of suppliers, bargaining power of buyers, threat of substitute products or services, and existing industry rivalry.

Reasons to Purchase this Report:

  • Estimates 2022-2027 2021-2025 Threedimensional Integrated Circuit And ThroughSilicon Via Interconnect Report on, Status and Forecast, by Players, Types and Applications market development trends with the recent trends and SWOT analysis
  • Market dynamics scenario, along with growth opportunities of the market in the years to come
  • Market segmentation analysis including qualitative and quantitative research incorporating the impact of economic and policy aspects
  • Regional and country level analysis integrating the demand and supply forces that are influencing the growth of the market.
  • Market value (USD Million) and volume (Units Million) data for each segment and sub-segment
  • Competitive landscape involving the market share of major players, along with the new projects and strategies adopted by players in the past five years
  • Comprehensive company profiles covering the product offerings, key financial information, recent developments, SWOT analysis, and strategies employed by the major market players
  • 1-year analyst support, along with the data support in excel format.

Research Methodology:

The research methodology used to estimate and forecast this market begins by capturing the revenues of the key players and their shares in the market. Various secondary sources such as press releases, annual reports, non-profit organizations, industry associations, governmental agencies and customs data, have been used to identify and collect information useful for this extensive commercial study of the market. Calculations based on this led to the overall market size. After arriving at the overall market size, the total market has been split into several segments and subsegments, which have then been verified through primary research by conducting extensive interviews with industry experts such as CEOs, VPs, directors, and executives. The data triangulation and market breakdown procedures have been employed to complete the overall market engineering process and arrive at the exact statistics for all segments and subsegments.

Report Attributes Report Details
Report Title Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Insights, Forecast to 2028
Historical Year 2018 to 2022 (Data from 2010 can be provided as per availability)
Base Year 2021
Forecast Year 2029
Number of Pages 109 Pages
Customization Available Yes, the report can be customized as per your need.

TABLE OF CONTENTS

1 Report Business Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Growth Rate by Type, 2017 VS 2021 VS 2028
1.2.2 Memories
1.2.3 Sensors
1.2.4 LEDs
1.2.5 Others
1.3 Market by Application
1.3.1 Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Growth Rate by Application, 2017 VS 2021 VS 2028
1.3.2 Military
1.3.3 Aerospace and Defense
1.3.4 Consumer Electronics
1.3.5 Automotive
1.3.6 Others
1.4 Study Objectives
1.5 Years Considered
2 Global Growth Trends
2.1 Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Perspective (2017-2028)
2.2 Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Growth Trends by Region
2.2.1 Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Region: 2017 VS 2021 VS 2028
2.2.2 Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Historic Market Size by Region (2017-2022)
2.2.3 Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Forecasted Market Size by Region (2023-2028)
2.3 Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Dynamics
2.3.1 Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Industry Trends
2.3.2 Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Drivers
2.3.3 Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Challenges
2.3.4 Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Players by Revenue
3.1.1 Global Top Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Players by Revenue (2017-2022)
3.1.2 Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Revenue Market Share by Players (2017-2022)
3.2 Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Revenue
3.4 Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Concentration Ratio
3.4.1 Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Revenue in 2021
3.5 Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Key Players Head office and Area Served
3.6 Key Players Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Product Solution and Service
3.7 Date of Enter into Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Breakdown Data by Type
4.1 Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Historic Market Size by Type (2017-2022)
4.2 Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Forecasted Market Size by Type (2023-2028)
5 Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Breakdown Data by Application
5.1 Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Historic Market Size by Application (2017-2022)
5.2 Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Forecasted Market Size by Application (2023-2028)
6 North America
6.1 North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size (2017-2028)
6.2 North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type
6.2.1 North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2017-2022)
6.2.2 North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2023-2028)
6.2.3 North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Share by Type (2017-2028)
6.3 North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application
6.3.1 North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2017-2022)
6.3.2 North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2023-2028)
6.3.3 North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Share by Application (2017-2028)
6.4 North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country
6.4.1 North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country (2017-2022)
6.4.2 North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country (2023-2028)
6.4.3 United States
6.4.4 Canada
7 Europe
7.1 Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size (2017-2028)
7.2 Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type
7.2.1 Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2017-2022)
7.2.2 Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2023-2028)
7.2.3 Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Share by Type (2017-2028)
7.3 Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application
7.3.1 Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2017-2022)
7.3.2 Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2023-2028)
7.3.3 Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Share by Application (2017-2028)
7.4 Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country
7.4.1 Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country (2017-2022)
7.4.2 Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country (2023-2028)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size (2017-2028)
8.2 Asia-Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type
8.2.1 Asia-Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2017-2022)
8.2.2 Asia-Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2023-2028)
8.2.3 Asia-Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Share by Type (2017-2028)
8.3 Asia-Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application
8.3.1 Asia-Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2017-2022)
8.3.2 Asia-Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2023-2028)
8.3.3 Asia-Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Share by Application (2017-2028)
8.4 Asia-Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Region
8.4.1 Asia-Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Region (2017-2022)
8.4.2 Asia-Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Region (2023-2028)
8.4.3 China
8.4.4 Japan
8.4.5 South Korea
8.4.6 Southeast Asia
8.4.7 India
8.4.8 Australia
9 Latin America
9.1 Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size (2017-2028)
9.2 Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type
9.2.1 Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2017-2022)
9.2.2 Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2023-2028)
9.2.3 Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Share by Type (2017-2028)
9.3 Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application
9.3.1 Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2017-2022)
9.3.2 Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2023-2028)
9.3.3 Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Share by Application (2017-2028)
9.4 Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country
9.4.1 Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country (2017-2022)
9.4.2 Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country (2023-2028)
9.4.3 Mexico
9.4.4 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size (2017-2028)
10.2 Middle East & Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type
10.2.1 Middle East & Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2017-2022)
10.2.2 Middle East & Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2023-2028)
10.2.3 Middle East & Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Share by Type (2017-2028)
10.3 Middle East & Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application
10.3.1 Middle East & Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2017-2022)
10.3.2 Middle East & Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2023-2028)
10.3.3 Middle East & Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Share by Application (2017-2028)
10.4 Middle East & Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country
10.4.1 Middle East & Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country (2017-2022)
10.4.2 Middle East & Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country (2023-2028)
10.4.3 Turkey
10.4.4 Saudi Arabia
10.4.5 UAE
11 Key Players Profiles
11.1 Amkor Technology
11.1.1 Amkor Technology Company Details
11.1.2 Amkor Technology Business Overview
11.1.3 Amkor Technology Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Introduction
11.1.4 Amkor Technology Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
11.1.5 Amkor Technology Recent Developments
11.2 Elpida Memory
11.2.1 Elpida Memory Company Details
11.2.2 Elpida Memory Business Overview
11.2.3 Elpida Memory Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Introduction
11.2.4 Elpida Memory Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
11.2.5 Elpida Memory Recent Developments
11.3 Intel Corporation
11.3.1 Intel Corporation Company Details
11.3.2 Intel Corporation Business Overview
11.3.3 Intel Corporation Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Introduction
11.3.4 Intel Corporation Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
11.3.5 Intel Corporation Recent Developments
11.4 Micron Technology Inc.
11.4.1 Micron Technology Inc. Company Details
11.4.2 Micron Technology Inc. Business Overview
11.4.3 Micron Technology Inc. Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Introduction
11.4.4 Micron Technology Inc. Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
11.4.5 Micron Technology Inc. Recent Developments
11.5 MonolithIC 3D Inc.
11.5.1 MonolithIC 3D Inc. Company Details
11.5.2 MonolithIC 3D Inc. Business Overview
11.5.3 MonolithIC 3D Inc. Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Introduction
11.5.4 MonolithIC 3D Inc. Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
11.5.5 MonolithIC 3D Inc. Recent Developments
11.6 Renesas Electronics Corporation
11.6.1 Renesas Electronics Corporation Company Details
11.6.2 Renesas Electronics Corporation Business Overview
11.6.3 Renesas Electronics Corporation Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Introduction
11.6.4 Renesas Electronics Corporation Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
11.6.5 Renesas Electronics Corporation Recent Developments
11.7 Sony
11.7.1 Sony Company Details
11.7.2 Sony Business Overview
11.7.3 Sony Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Introduction
11.7.4 Sony Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
11.7.5 Sony Recent Developments
11.8 Samsung Electronics
11.8.1 Samsung Electronics Company Details
11.8.2 Samsung Electronics Business Overview
11.8.3 Samsung Electronics Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Introduction
11.8.4 Samsung Electronics Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
11.8.5 Samsung Electronics Recent Developments
11.9 IBM
11.9.1 IBM Company Details
11.9.2 IBM Business Overview
11.9.3 IBM Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Introduction
11.9.4 IBM Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
11.9.5 IBM Recent Developments
11.10 Qualcomm
11.10.1 Qualcomm Company Details
11.10.2 Qualcomm Business Overview
11.10.3 Qualcomm Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Introduction
11.10.4 Qualcomm Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
11.10.5 Qualcomm Recent Developments
11.11 STMicroelectronics
11.11.1 STMicroelectronics Company Details
11.11.2 STMicroelectronics Business Overview
11.11.3 STMicroelectronics Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Introduction
11.11.4 STMicroelectronics Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
11.11.5 STMicroelectronics Recent Developments
11.12 Texas Instruments
11.12.1 Texas Instruments Company Details
11.12.2 Texas Instruments Business Overview
11.12.3 Texas Instruments Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Introduction
11.12.4 Texas Instruments Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
11.12.5 Texas Instruments Recent Developments
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Author Details
13.3 Disclaimer

LIST OF TABLES & FIGURES

List of Tables
Table 1. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Growth Rate by Type (US$ Million), 2017 VS 2021 VS 2028
Table 2. Key Players of Memories
Table 3. Key Players of Sensors
Table 4. Key Players of LEDs
Table 5. Key Players of Others
Table 6. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Growth Rate by Application (US$ Million), 2017 VS 2021 VS 2028
Table 7. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Region (US$ Million): 2017 VS 2021 VS 2028
Table 8. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Region (2017-2022) & (US$ Million)
Table 9. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Share by Region (2017-2022)
Table 10. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Forecasted Market Size by Region (2023-2028) & (US$ Million)
Table 11. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Share by Region (2023-2028)
Table 12. Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Trends
Table 13. Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Drivers
Table 14. Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Challenges
Table 15. Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Restraints
Table 16. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Revenue by Players (2017-2022) & (US$ Million)
Table 17. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Revenue Share by Players (2017-2022)
Table 18. Global Top Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect as of 2021)
Table 19. Ranking of Global Top Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Companies by Revenue (US$ Million) in 2021
Table 20. Global 5 Largest Players Market Share by Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Revenue (CR5 and HHI) & (2017-2022)
Table 21. Key Players Headquarters and Area Served
Table 22. Key Players Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Product Solution and Service
Table 23. Date of Enter into Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market
Table 24. Mergers & Acquisitions, Expansion Plans
Table 25. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2017-2022) & (US$ Million)
Table 26. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Revenue Market Share by Type (2017-2022)
Table 27. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Forecasted Market Size by Type (2023-2028) & (US$ Million)
Table 28. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Revenue Market Share by Type (2023-2028)
Table 29. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2017-2022) & (US$ Million)
Table 30. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Revenue Share by Application (2017-2022)
Table 31. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Forecasted Market Size by Application (2023-2028) & (US$ Million)
Table 32. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Revenue Share by Application (2023-2028)
Table 33. North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2017-2022) & (US$ Million)
Table 34. North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2023-2028) & (US$ Million)
Table 35. North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2017-2022) & (US$ Million)
Table 36. North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2023-2028) & (US$ Million)
Table 37. North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country (2017-2022) & (US$ Million)
Table 38. North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country (2023-2028) & (US$ Million)
Table 39. Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2017-2022) & (US$ Million)
Table 40. Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2023-2028) & (US$ Million)
Table 41. Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2017-2022) & (US$ Million)
Table 42. Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2023-2028) & (US$ Million)
Table 43. Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country (2017-2022) & (US$ Million)
Table 44. Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country (2023-2028) & (US$ Million)
Table 45. Asia Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2017-2022) & (US$ Million)
Table 46. Asia Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2023-2028) & (US$ Million)
Table 47. Asia Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2017-2022) & (US$ Million)
Table 48. Asia Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2023-2028) & (US$ Million)
Table 49. Asia Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Region (2017-2022) & (US$ Million)
Table 50. Asia Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Region (2023-2028) & (US$ Million)
Table 51. Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2017-2022) & (US$ Million)
Table 52. Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2023-2028) & (US$ Million)
Table 53. Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2017-2022) & (US$ Million)
Table 54. Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2023-2028) & (US$ Million)
Table 55. Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country (2017-2022) & (US$ Million)
Table 56. Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country (2023-2028) & (US$ Million)
Table 57. Middle East and Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2017-2022) & (US$ Million)
Table 58. Middle East and Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Type (2023-2028) & (US$ Million)
Table 59. Middle East and Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2017-2022) & (US$ Million)
Table 60. Middle East and Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Application (2023-2028) & (US$ Million)
Table 61. Middle East and Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country (2017-2022) & (US$ Million)
Table 62. Middle East and Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size by Country (2023-2028) & (US$ Million)
Table 63. Amkor Technology Company Details
Table 64. Amkor Technology Business Overview
Table 65. Amkor Technology Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Product
Table 66. Amkor Technology Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022) & (US$ Million)
Table 67. Amkor Technology Recent Developments
Table 68. Elpida Memory Company Details
Table 69. Elpida Memory Business Overview
Table 70. Elpida Memory Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Product
Table 71. Elpida Memory Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022) & (US$ Million)
Table 72. Elpida Memory Recent Developments
Table 73. Intel Corporation Company Details
Table 74. Intel Corporation Business Overview
Table 75. Intel Corporation Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Product
Table 76. Intel Corporation Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022) & (US$ Million)
Table 77. Intel Corporation Recent Developments
Table 78. Micron Technology Inc. Company Details
Table 79. Micron Technology Inc. Business Overview
Table 80. Micron Technology Inc. Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Product
Table 81. Micron Technology Inc. Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022) & (US$ Million)
Table 82. Micron Technology Inc. Recent Developments
Table 83. MonolithIC 3D Inc. Company Details
Table 84. MonolithIC 3D Inc. Business Overview
Table 85. MonolithIC 3D Inc. Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Product
Table 86. MonolithIC 3D Inc. Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022) & (US$ Million)
Table 87. MonolithIC 3D Inc. Recent Developments
Table 88. Renesas Electronics Corporation Company Details
Table 89. Renesas Electronics Corporation Business Overview
Table 90. Renesas Electronics Corporation Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Product
Table 91. Renesas Electronics Corporation Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022) & (US$ Million)
Table 92. Renesas Electronics Corporation Recent Developments
Table 93. Sony Company Details
Table 94. Sony Business Overview
Table 95. Sony Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Product
Table 96. Sony Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022) & (US$ Million)
Table 97. Sony Recent Developments
Table 98. Samsung Electronics Company Details
Table 99. Samsung Electronics Business Overview
Table 100. Samsung Electronics Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Product
Table 101. Samsung Electronics Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022) & (US$ Million)
Table 102. Samsung Electronics Recent Developments
Table 103. IBM Company Details
Table 104. IBM Business Overview
Table 105. IBM Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Product
Table 106. IBM Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022) & (US$ Million)
Table 107. IBM Recent Developments
Table 108. Qualcomm Company Details
Table 109. Qualcomm Business Overview
Table 110. Qualcomm Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Product
Table 111. Qualcomm Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022) & (US$ Million)
Table 112. Qualcomm Recent Developments
Table 113. STMicroelectronics Company Details
Table 114. STMicroelectronics Business Overview
Table 115. STMicroelectronics Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Product
Table 116. STMicroelectronics Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022) & (US$ Million)
Table 117. STMicroelectronics Recent Developments
Table 118. Texas Instruments Company Details
Table 119. Texas Instruments Business Overview
Table 120. Texas Instruments Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Product
Table 121. Texas Instruments Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022) & (US$ Million)
Table 122. Texas Instruments Recent Developments
Table 123. Research Programs/Design for This Report
Table 124. Key Data Information from Secondary Sources
Table 125. Key Data Information from Primary Sources
List of Figures
Figure 1. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Share by Type: 2021 VS 2028
Figure 2. Memories Features
Figure 3. Sensors Features
Figure 4. LEDs Features
Figure 5. Others Features
Figure 6. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Share by Application: 2021 VS 2028
Figure 7. Military Case Studies
Figure 8. Aerospace and Defense Case Studies
Figure 9. Consumer Electronics Case Studies
Figure 10. Automotive Case Studies
Figure 11. Others Case Studies
Figure 12. Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Report Years Considered
Figure 13. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size (US$ Million), Year-over-Year: 2017-2028
Figure 14. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size, (US$ Million), 2017 VS 2021 VS 2028
Figure 15. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Share by Region: 2021 VS 2028
Figure 16. Global Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Share by Players in 2021
Figure 17. Global Top Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect as of 2021)
Figure 18. The Top 10 and 5 Players Market Share by Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Revenue in 2021
Figure 19. North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY (2017-2028) & (US$ Million)
Figure 20. North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Market Share by Type (2017-2028)
Figure 21. North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Market Share by Application (2017-2028)
Figure 22. North America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Share by Country (2017-2028)
Figure 23. United States Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 24. Canada Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 25. Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY (2017-2028) & (US$ Million)
Figure 26. Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Market Share by Type (2017-2028)
Figure 27. Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Market Share by Application (2017-2028)
Figure 28. Europe Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Share by Country (2017-2028)
Figure 29. Germany Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 30. France Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 31. U.K. Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 32. Italy Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 33. Russia Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 34. Nordic Countries Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 35. Asia-Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY (2017-2028) & (US$ Million)
Figure 36. Asia Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Market Share by Type (2017-2028)
Figure 37. Asia Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Market Share by Application (2017-2028)
Figure 38. Asia Pacific Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Share by Region (2017-2028)
Figure 39. China Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 40. Japan Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 41. South Korea Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 42. Southeast Asia Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 43. India Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 44. Australia Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
List of Figures
Figure 45. Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY (2017-2028) & (US$ Million)
Figure 46. Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Market Share by Type (2017-2028)
Figure 47. Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Market Share by Application (2017-2028)
Figure 48. Latin America Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Share by Country (2017-2028)
Figure 49. Mexico Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 50. Brazil Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 51. Middle East & Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY (2017-2028) & (US$ Million)
Figure 52. Middle East and Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Market Share by Type (2017-2028)
Figure 53. Middle East and Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Market Share by Application (2017-2028)
Figure 54. Middle East and Africa Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size Share by Country (2017-2028)
Figure 55. Turkey Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 56. Saudi Arabia Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 57. UAE Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Market Size YoY Growth (2017-2028) & (US$ Million)
Figure 58. Amkor Technology Revenue Growth Rate in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
Figure 59. Elpida Memory Revenue Growth Rate in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
Figure 60. Intel Corporation Revenue Growth Rate in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
Figure 61. Micron Technology Inc. Revenue Growth Rate in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
Figure 62. MonolithIC 3D Inc. Revenue Growth Rate in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
Figure 63. Renesas Electronics Corporation Revenue Growth Rate in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
Figure 64. Sony Revenue Growth Rate in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
Figure 65. Samsung Electronics Revenue Growth Rate in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
Figure 66. IBM Revenue Growth Rate in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
Figure 67. Qualcomm Revenue Growth Rate in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
Figure 68. STMicroelectronics Revenue Growth Rate in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
Figure 69. Texas Instruments Revenue Growth Rate in Three-dimensional Integrated Circuit And Through-Silicon Via Interconnect Business (2017-2022)
Figure 70. Bottom-up and Top-down Approaches for This Report
Figure 71. Data Triangulation
Figure 72. Key Executives Interviewed

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