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The global Temporary Bonding Systems market size is estimated to be $165 million in 2023, and will reach $327 million by 2032, growing at a CAGR of 7.9% during the forecast period from 2024 to 2032.

This report studies the Temporary Bonding Systems market, covering market size for segment by type (Semi-Automatic Bonding Equipment, Fully Automatic Bonding Equipment, etc.), by application (Advanced Packaging, MEMS, etc.), by sales channel (Direct Channel, Distribution Channel), by player (Tokyo Ohka Kogyo (TOK), SUSS MicroTec, EV Group, AML, TAZMO, etc.) and by region (North America, Europe, Asia-Pacific, South America and Middle East & Africa).

This report provides detailed historical analysis of global market for Temporary Bonding Systems from 2018-2023, and provides extensive market forecasts from 2024-2032 by region/country and subsectors. It covers the sales/revenue/value, gross margin, historical growth and future perspectives in the Temporary Bonding Systems market.

Leading Players of Temporary Bonding Systems including:

• Tokyo Ohka Kogyo (TOK)
• SUSS MicroTec
• EV Group
• AML
• TAZMO
• Ayumi Industry
• Shanghai Micro Electronics Equipment (SMEE)

• Semi-Automatic Bonding Equipment
• Fully Automatic Bonding Equipment

• Advanced Packaging
• MEMS
• CMOS
• Others

• Direct Channel
• Distribution Channel

• North America (United States and Canada)
• Europe (Germany, UK, France, Italy, Spain, and Russia, etc.)
• Asia-Pacific (China, Japan, Korea, India, Australia, and Southeast Asia, etc.)
• South America (Brazil, Mexico, and Argentina, etc.)
• Middle East & Africa (Turkey, UAE, Saudi Arabia, and South Africa, etc.)