The Global 5G Rigid PCB market was valued at US$ 20240 million in 2023 and is projected to reach US$ 34290 million by 2030, at a CAGR of 7.8% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The global key manufacturers of 5G Rigid PCB include Panasonic Industry, Xinfeng Huihe Circuits, Chin Poon Industrial, Tripod Technology, Shennan Circuits, WUS Printed Circuit, Kinsus, Zhen Ding Technology Holding Limited and Hannstar Board, etc. in 2023, the global top five players have a share approximately % in terms of revenue.
This report aims to provide a comprehensive presentation of the global market for 5G Rigid PCB, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 5G Rigid PCB. This report contains market size and forecasts of 5G Rigid PCB in global, including the following market information:
- Global 5G Rigid PCB Market Revenue, 2019-2024, 2025-2030, ($ millions)
- Global 5G Rigid PCB Market Sales, 2019-2024, 2025-2030, (K Units)
- Global top five 5G Rigid PCB companies in 2023 (%)
We surveyed the 5G Rigid PCB manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global 5G Rigid PCB Market, by Type, 2019-2024, 2025-2030 ($ Millions) & (K Units)
Global 5G Rigid PCB Market Segment Percentages, by Type, 2023 (%)
- Single-sided
- Double-sided
- Multi-layered
- High-density Interconnect (HDI)
- Others
Global 5G Rigid PCB Market, by Application, 2019-2024, 2025-2030 ($ Millions) & (K Units)
Global 5G Rigid PCB Market Segment Percentages, by Application, 2023 (%)
- Automotive
- Telecommunication
- Consumer Electronics
- Industrial
- Others
Global 5G Rigid PCB Market, By Region and Country, 2019-2024, 2025-2030 ($ Millions) & (K Units)
Global 5G Rigid PCB Market Segment Percentages, By Region and Country, 2023 (%)
- North America
- US
- Canada
- Mexico
- Europe
- Germany
- France
- U.K.
- Italy
- Russia
- Nordic Countries
- Benelux
- Rest of Europe
- Asia
- China
- Japan
- South Korea
- Southeast Asia
- India
- Rest of Asia
- South America
- Brazil
- Argentina
- Rest of South America
- Middle East & Africa
- Turkey
- Israel
- Saudi Arabia
- UAE
- Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
- Key companies 5G Rigid PCB revenues in global market, 2019-2024 (Estimated), ($ millions)
- Key companies 5G Rigid PCB revenues share in global market, 2023 (%)
- Key companies 5G Rigid PCB sales in global market, 2019-2024 (Estimated), (K Units)
- Key companies 5G Rigid PCB sales share in global market, 2023 (%)
key players include:
- Panasonic Industry
- Xinfeng Huihe Circuits
- Chin Poon Industrial
- Tripod Technology
- Shennan Circuits
- WUS Printed Circuit
- Kinsus
- Zhen Ding Technology Holding Limited
- Hannstar Board
- Compeq Manufacturing
- NIPPON MEKTRON
- Unimicron
- TTM Technologies
- Sierra Circuits
- Lexington Europe GmbH
- Winonics
Outline of Major Chapters:
Chapter 1: Introduces the definition of 5G Rigid PCB, market overview.
Chapter 2: Global 5G Rigid PCB market size in revenue and volume.
Chapter 3: Detailed analysis of 5G Rigid PCB manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of 5G Rigid PCB in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global 5G Rigid PCB capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
