Report overview
The global Epoxy Molding Compound for Advanced Packaging market was valued at US$ million in 2023 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2023, While China is Forecast to Reach $ Million.
Semiconductor Encapsulation Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of Epoxy Molding Compound for Advanced Packaging include Sumitomo Bakelite, Hitachi Chemical, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Kyocera, KCC, Samsung SDI and Eternal Materials, etc. in 2023, the global top five players have a share approximately % in terms of revenue.
This report aims to provide a comprehensive presentation of the global market for Epoxy Molding Compound for Advanced Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Epoxy Molding Compound for Advanced Packaging. This report contains market size and forecasts of Epoxy Molding Compound for Advanced Packaging in global, including the following market information:
Global Epoxy Molding Compound for Advanced Packaging Market Revenue, 2019-2024, 2025-2030, ($ millions)
Global Epoxy Molding Compound for Advanced Packaging Market Sales, 2019-2024, 2025-2030, (Tons)
Global top five Epoxy Molding Compound for Advanced Packaging companies in 2023 (%)
We surveyed the Epoxy Molding Compound for Advanced Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Epoxy Molding Compound for Advanced Packaging Market, by Type, 2019-2024, 2025-2030 ($ Millions) & (Tons)
Global Epoxy Molding Compound for Advanced Packaging Market Segment Percentages, by Type, 2023 (%)
Semiconductor Encapsulation
Electronic Components
Global Epoxy Molding Compound for Advanced Packaging Market, by Application, 2019-2024, 2025-2030 ($ Millions) & (Tons)
Global Epoxy Molding Compound for Advanced Packaging Market Segment Percentages, by Application, 2023 (%)
3C Products
Home Appliances
Automotive Electronics
Communication
Othera
Global Epoxy Molding Compound for Advanced Packaging Market, By Region and Country, 2019-2024, 2025-2030 ($ Millions) & (Tons)
Global Epoxy Molding Compound for Advanced Packaging Market Segment Percentages, By Region and Country, 2023 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Epoxy Molding Compound for Advanced Packaging revenues in global market, 2019-2024 (Estimated), ($ millions)
Key companies Epoxy Molding Compound for Advanced Packaging revenues share in global market, 2023 (%)
Key companies Epoxy Molding Compound for Advanced Packaging sales in global market, 2019-2024 (Estimated), (Tons)
Key companies Epoxy Molding Compound for Advanced Packaging sales share in global market, 2023 (%)
Further, the report presents profiles of competitors in the market, key players include:
Sumitomo Bakelite
Hitachi Chemical
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Samsung SDI
Eternal Materials
Jiangsu Zhongpeng New Material
Shin-Etsu Chemical
Hexion
Nepes
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Beijing Sino-tech Electronic Material
Outline of Major Chapters:
Chapter 1: Introduces the definition of Epoxy Molding Compound for Advanced Packaging, market overview.
Chapter 2: Global Epoxy Molding Compound for Advanced Packaging market size in revenue and volume.
Chapter 3: Detailed analysis of Epoxy Molding Compound for Advanced Packaging manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Epoxy Molding Compound for Advanced Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Epoxy Molding Compound for Advanced Packaging capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
