Report overview
Printed circuit board (PCB) is a foundational building block of most modern electronic devices. Semiconductors, connectors, resistors, diodes, capacitors and radio devices are mounted on the PCB, and they work with one another through the PCB.
This report aims to provide a comprehensive presentation of the global market for 5G PCB, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 5G PCB. This report contains market size and forecasts of 5G PCB in global, including the following market information:
Global 5G PCB Market Revenue, 2019-2024, 2025-2030, ($ millions)
Global 5G PCB Market Sales, 2019-2024, 2025-2030, (K Units)
Global top five 5G PCB companies in 2023 (%)
The global 5G PCB market was valued at US$ million in 2023 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2023, While China is Forecast to Reach $ Million.
Rigid Board (RPCB) Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of 5G PCB include Shennan Circuits Company, WUS Printed Circuit, Avary Holding (Zhen Ding), Nippon Mektron, SHENGYI ELECTRONICS, Kinwong, AT&S, Compeq and Tripod, etc. in 2023, the global top five players have a share approximately % in terms of revenue.
We surveyed the 5G PCB manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global 5G PCB Market, by Type, 2019-2024, 2025-2030 ($ Millions) & (K Units)
Global 5G PCB Market Segment Percentages, by Type, 2023 (%)
Rigid Board (RPCB)
Flexible Board (FPC)
Rigid-Flex Board
Global 5G PCB Market, by Application, 2019-2024, 2025-2030 ($ Millions) & (K Units)
Global 5G PCB Market Segment Percentages, by Application, 2023 (%)
Communication
Consumer Electronics
Industrial Control and Medical Equipment
Automotive Electronics
Computer
Military
Aerospace
Global 5G PCB Market, By Region and Country, 2019-2024, 2025-2030 ($ Millions) & (K Units)
Global 5G PCB Market Segment Percentages, By Region and Country, 2023 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies 5G PCB revenues in global market, 2019-2024 (Estimated), ($ millions)
Key companies 5G PCB revenues share in global market, 2023 (%)
Key companies 5G PCB sales in global market, 2019-2024 (Estimated), (K Units)
Key companies 5G PCB sales share in global market, 2023 (%)
Further, the report presents profiles of competitors in the market, key players include:
Shennan Circuits Company
WUS Printed Circuit
Avary Holding (Zhen Ding)
Nippon Mektron
SHENGYI ELECTRONICS
Kinwong
AT&S
Compeq
Tripod
MEIKO
Outline of Major Chapters:
Chapter 1: Introduces the definition of 5G PCB, market overview.
Chapter 2: Global 5G PCB market size in revenue and volume.
Chapter 3: Detailed analysis of 5G PCB manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of 5G PCB in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global 5G PCB capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
