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The Global "eSIM Chip Market" was valued at US$ 903.6 Million in 2023 and is projected to reach US$ 4099.4 Million by 2030, exhibiting a Compound Annual Growth Rate (CAGR) of 21.3% during the forecast period (2023-2030).

The global key manufacturers of eSIM Chip include Samsung Semiconductor, STMicroelectronics, Thales Group, Infineon, STMicroelectronics, China Mobile IoT Company Limit, Tongxin Microelectronics Co., Ltd. and Wuhan Tianyu Information Industry Co., Ltd., etc. in 2023, the global top five players have a share approximately % in terms of revenue.

The eSIM chip refers to he SIM card insert into the device and updating its configuration through wireless remote download. Compared with the traditional pluggable SIM card, eSIM greatly reduces the card space on the device, and its volume is reduced to 10% of the traditional SIM card. In addition, it is directly embedded in the device in form, realizing the true card-free device, thus increasing the flexibility of product design; Its seismic resistance, high temperature resistance and reliability are stronger, and it can better adapt to the harsh working environment; Not bound to a specific operator and remote configuration support flexible switching of operator data to ensure fast and stable connection.

This report aims to provide a comprehensive presentation of the global market for eSIM Chip, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding eSIM Chip. This report contains market size and forecasts of eSIM Chip in global, including the following market information:

We surveyed the eSIM Chip manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:
By Type:

• Consumer eSIM
• M2M (Machine-to-Machine) eSIM

By Application:

• Consumer Electronics
• Automotive
• Other

By Region and Country:

• North America (United States, Canada, Mexico)
• Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe)
• Asia-Pacific (China, India, Japan, South Korea, Australia, Rest of APAC)
• The Middle East and Africa (Middle East, Africa)
• South and Central America (Brazil, Argentina, Rest of SCA)

Competitor Analysis
The report also provides analysis of leading market participants including:

• Key companies eSIM Chip revenues in global market, 2019-2024 (Estimated), ($ millions)
• Key companies eSIM Chip revenues share in global market, 2023 (%)
• Key companies eSIM Chip sales in global market, 2019-2024 (Estimated), (K Pcs)
• Key companies eSIM Chip sales share in global market, 2023 (%)

Key Players Include:

• Samsung Semiconductor
• STMicroelectronics
• Thales Group
• Infineon
• STMicroelectronics
• China Mobile IoT Company Limit
• Tongxin Microelectronics Co., Ltd.
• Wuhan Tianyu Information Industry Co., Ltd.

Outline of Major Chapters:
Chapter 1: Introduces the definition of eSIM Chip, market overview.
Chapter 2: Global eSIM Chip market size in revenue and volume.
Chapter 3: Detailed analysis of eSIM Chip manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of eSIM Chip in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global eSIM Chip capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.