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Wi-Fi Chip and Module Market, Global Outlook and Forecast 2024-2030

Wi-Fi Chip and Module Market, Global Outlook and Forecast 2024-2030

  • Published on : 20 June 2024
  • Pages :79
  • Report Code:SMR-7962703

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Report overview

The global Wi-Fi Chip and Module market was valued at US$ 7.6 billion in 2023 and is predicted to reach US$ 12.8 billion by 2030, exhibiting a Compound Annual Growth Rate (CAGR) of 8.2% during the forecast period (2023-2030).

The global key manufacturers of Wi-Fi Chip and Module include Qualcomm, Realtek, Broadcom, Intel, Marvell, Microchip, Cypress Semiconductor, Shanghai MXCHIP Information Technology and Espressif Systems, etc. in 2023, the global top five players have a share approximately % in terms of revenue.
This report aims to provide a comprehensive presentation of the global market for Wi-Fi Chip and Module, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wi-Fi Chip and Module. This report contains market size and forecasts of Wi-Fi Chip and Module in global, including the following market information:

  • Global Wi-Fi Chip and Module Market Revenue, 2019-2024, 2025-2030, ($ millions)
  • Global Wi-Fi Chip and Module Market Sales, 2019-2024, 2025-2030, (K Units)
  • Global top five Wi-Fi Chip and Module companies in 2023 (%)

We has surveyed the Wi-Fi Chip and Module manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wi-Fi Chip and Module Market, by Type, 2019-2024, 2025-2030 ($ Millions) & (K Units)
Global Wi-Fi Chip and Module Market Segment Percentages, by Type, 2023 (%)

  • 802.11n Standard
  • 802.11ac Standard
  • 802.11ad Standard
  • Others

Global Wi-Fi Chip and Module Market, by Application, 2019-2024, 2025-2030 ($ Millions) & (K Units)
Global Wi-Fi Chip and Module Market Segment Percentages, by Application, 2023 (%)

  • Cell Phone
  • Computer
  • Smart Home
  • Others

Global Wi-Fi Chip and Module Market, By Region and Country, 2019-2024, 2025-2030 ($ Millions) & (K Units)
Global Wi-Fi Chip and Module Market Segment Percentages, By Region and Country, 2023 (%)

  • North America (United States, Canada, Mexico)
  • Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe)
  • Asia-Pacific (China, India, Japan, South Korea, Australia, Rest of APAC)
  • The Middle East and Africa (Middle East, Africa)
  • South and Central America (Brazil, Argentina, Rest of SCA)

Competitor Analysis
The report also provides analysis of leading market participants including:

  • Key companies Wi-Fi Chip and Module revenues in global market, 2019-2024 (Estimated), ($ millions)
  • Key companies Wi-Fi Chip and Module revenues share in global market, 2023 (%)
  • Key companies Wi-Fi Chip and Module sales in global market, 2019-2024 (Estimated), (K Units)
  • Key companies Wi-Fi Chip and Module sales share in global market, 2023 (%)

key players include:

  • Qualcomm
  • Realtek
  • Broadcom
  • Intel
  • Marvell
  • Microchip
  • Cypress Semiconductor
  • Shanghai MXCHIP Information Technology
  • Espressif Systems
  • Hangzhou Yaguan Technology
  • Shenzhen CECport Technologies

Outline of Major Chapters:

Chapter 1: Introduces the definition of Wi-Fi Chip and Module, market overview.
Chapter 2: Global Wi-Fi Chip and Module market size in revenue and volume.
Chapter 3: Detailed analysis of Wi-Fi Chip and Module manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Wi-Fi Chip and Module in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Wi-Fi Chip and Module capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.