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The global Solder Paste for Electronic Products market was valued at US$ 2.84 billion in 2023 and is projected to reach US$ 3.85 billion by 2030, exhibiting a Compound Annual Growth Rate (CAGR) of 4.7% during the forecast period (2024-2030). This growth is expected despite the impact of the COVID-19 pandemic and the Russia-Ukraine War.​

The global key manufacturers of Solder Paste for Electronic Products include Senju, MacDermid Alpha Electronics Solutions, Heraeus, Tamura, Henkel, Indium, Shengmao, Inventec and KOKI, etc. in 2023, the global top five players have a share approximately % in terms of revenue.

Solder paste is a new type of soldering material that emerged with SMT. It is a paste mixture formed by mixing solder powder, flux, and other surfactants and thixotropic agents. It is mainly used for soldering electronic components such as PCB surface resistance, capacitor and IC in SMT industry. This report studies solder paste for electronics. It mainly includes consumer electronics, automotive electronics and other precision electronics.
This report aims to provide a comprehensive presentation of the global market for Solder Paste for Electronic Products, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Solder Paste for Electronic Products. This report contains market size and forecasts of Solder Paste for Electronic Products in global, including the following market information:

• Global Solder Paste for Electronic Products Market Revenue, 2019-2024, 2025-2030, ($ millions)
• Global Solder Paste for Electronic Products Market Sales, 2019-2024, 2025-2030, (Tons)
• Global top five Solder Paste for Electronic Products companies in 2023 (%)

MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Solder Paste for Electronic Products manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Solder Paste for Electronic Products Market, by Type, 2019-2024, 2025-2030 ($ Millions) & (Tons)
Global Solder Paste for Electronic Products Market Segment Percentages, by Type, 2023 (%)

• Rosin Based Pastes
• Water Soluble Pastes
• No-clean Pastes

• Consumer Electronics
• Vehicle Electronics
• Other

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

• Key companies Solder Paste for Electronic Products revenues in global market, 2019-2024 (Estimated), ($ millions)
• Key companies Solder Paste for Electronic Products revenues share in global market, 2023 (%)
• Key companies Solder Paste for Electronic Products sales in global market, 2019-2024 (Estimated), (Tons)
• Key companies Solder Paste for Electronic Products sales share in global market, 2023 (%)

• Senju
• MacDermid Alpha Electronics Solutions
• Heraeus
• Tamura
• Henkel
• Indium
• Shengmao
• Inventec
• KOKI
• AIM
• Nihon Superior
• KAWADA
• Yashida
• Tongfang Tech
• Yong An
• DS HiMetal
• Eunow Company Limited

Outline of Major Chapters:
Chapter 1: Introduces the definition of Solder Paste for Electronic Products, market overview.
Chapter 2: Global Solder Paste for Electronic Products market size in revenue and volume.
Chapter 3: Detailed analysis of Solder Paste for Electronic Products manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Solder Paste for Electronic Products in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Solder Paste for Electronic Products capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.