Report overview
The global Heat Sink for Consumer Electronics market was valued at US$ million in 2023 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2023, While China is Forecast to Reach $ Million.
Copper Material Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of Heat Sink for Consumer Electronics include Alpha, Molex, TE Connectivity, Delta, Mecc.Al, Ohmite, Aavid Thermalloy, Sunon and Advanced Thermal Solutions, etc. in 2023, the global top five players have a share approximately % in terms of revenue.
The heat sink is a device that heats the easily heating electronic components in the electrical appliance. It is made of aluminum alloy, brass or bronze in plate shape, sheet shape, multiple sheet shape, etc. For example, the CPU in the computer needs to use a large heat sink, and the power supply pipe, line pipe, and power amplifier pipe in the TV need to use the heat sink. This report mainly studies the heat sink for consumer electronics.
This report aims to provide a comprehensive presentation of the global market for Heat Sink for Consumer Electronics, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Heat Sink for Consumer Electronics. This report contains market size and forecasts of Heat Sink for Consumer Electronics in global, including the following market information:
Global Heat Sink for Consumer Electronics Market Revenue, 2019-2024, 2025-2030, ($ millions)
Global Heat Sink for Consumer Electronics Market Sales, 2019-2024, 2025-2030, (M Pcs)
Global top five Heat Sink for Consumer Electronics companies in 2023 (%)
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Heat Sink for Consumer Electronics manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Heat Sink for Consumer Electronics Market, by Type, 2019-2024, 2025-2030 ($ Millions) & (M Pcs)
Global Heat Sink for Consumer Electronics Market Segment Percentages, by Type, 2023 (%)
Copper Material
Aluminum Alloy Material
Graphite or Graphene
Ceramic Material
Other
Global Heat Sink for Consumer Electronics Market, by Application, 2019-2024, 2025-2030 ($ Millions) & (M Pcs)
Global Heat Sink for Consumer Electronics Market Segment Percentages, by Application, 2023 (%)
Cell Phone
Computer
Television
Other
Global Heat Sink for Consumer Electronics Market, By Region and Country, 2019-2024, 2025-2030 ($ Millions) & (M Pcs)
Global Heat Sink for Consumer Electronics Market Segment Percentages, By Region and Country, 2023 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Heat Sink for Consumer Electronics revenues in global market, 2019-2024 (Estimated), ($ millions)
Key companies Heat Sink for Consumer Electronics revenues share in global market, 2023 (%)
Key companies Heat Sink for Consumer Electronics sales in global market, 2019-2024 (Estimated), (M Pcs)
Key companies Heat Sink for Consumer Electronics sales share in global market, 2023 (%)
Further, the report presents profiles of competitors in the market, key players include:
Alpha
Molex
TE Connectivity
Delta
Mecc.Al
Ohmite
Aavid Thermalloy
Sunon
Advanced Thermal Solutions
DAU
Apex Microtechnology
Radian
Bergquist,Inc.
Laird Technologies,Inc
Panasonics
Fujipoly
Tanyuan Technology Co.,Ltd.
Shenzhen Frd Science&technology Co.,ltd.
Stoneplus Thermal Management Technologies Limited
Dongguan SuQun Industrial Co.,Ltd
Shenzhen Aochuan Technology Co., Ltd.
AVC(Asia Vital Components Co., Ltd)
AAC Technologies Holdings Inc.
AURAS Technology Co.,Ltd.
NIDEC CHAUN-CHOUNG TECHNOLOGY CORPORATION
GuangDong Suqun New Material Co.,Ltd.
Suzhou Tianmai Thermal Technology Co., Ltd.
Jones Tech Plc
Suzhou Anjie Technology Co.,Ltd.
Shenzhen Everwin Precision Technology Co.,Ltd.
CUI
T-Global Technology
Wakefied-Vette
Outline of Major Chapters:
Chapter 1: Introduces the definition of Heat Sink for Consumer Electronics, market overview.
Chapter 2: Global Heat Sink for Consumer Electronics market size in revenue and volume.
Chapter 3: Detailed analysis of Heat Sink for Consumer Electronics manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Heat Sink for Consumer Electronics in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Heat Sink for Consumer Electronics capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
