Report overview
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes.
This report aims to provide a comprehensive presentation of the global market for Flat No-leads Package, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Flat No-leads Package. This report contains market size and forecasts of Flat No-leads Package in global, including the following market information:
Global Flat No-leads Package Market Revenue, 2018-2023, 2024-2032, ($ millions)
Global top five companies in 2022 (%)
The global Flat No-leads Package market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is to reach $ Million.
Air-cavity QFNs Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Flat No-leads Package include Amkor Technology, SFA Semicon, Advanced Dicing Technologies, DISCO, ASE, Orient Semiconductor Electronics, King Yuan Electronics, JCET and Suzhou Si-Era, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Flat No-leads Package companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Flat No-leads Package Market, by Type, 2018-2023, 2024-2032 ($ millions)
Global Flat No-leads Package Market Segment Percentages, by Type, 2022 (%)
Air-cavity QFNs
Plastic-moulded QFNs
Global Flat No-leads Package Market, by Application, 2018-2023, 2024-2032 ($ millions)
Global Flat No-leads Package Market Segment Percentages, by Application, 2022 (%)
Consumer Electronics
Automotive
Medical
Telecommunication
Others
Global Flat No-leads Package Market, By Region and Country, 2018-2023, 2024-2032 ($ Millions)
Global Flat No-leads Package Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Flat No-leads Package revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies Flat No-leads Package revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Amkor Technology
SFA Semicon
Advanced Dicing Technologies
DISCO
ASE
Orient Semiconductor Electronics
King Yuan Electronics
JCET
Suzhou Si-Era
Nantong Jiejing
Ningbo ChipEx Semiconductor
Outline of Major Chapters:
Chapter 1: Introduces the definition of Flat No-leads Package, market overview.
Chapter 2: Global Flat No-leads Package market size in revenue.
Chapter 3: Detailed analysis of Flat No-leads Package company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Flat No-leads Package in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.
