The global Wafer Level Packaging Technologies market was valued at US$ 2676.3 million in 2023 and is projected to reach US$ 4672.9 million by 2029, at a CAGR of 8.3% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. We statistics in the report are the equipment used in the wafer-level packaging process.
This report aims to provide a comprehensive presentation of the global market for Wafer Level Packaging Technologies, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Level Packaging Technologies. This report contains market size and forecasts of Wafer Level Packaging Technologies in global, including the following market information:
- Global Wafer Level Packaging Technologies Market Revenue, 2018-2023, 2024-2030, ($ millions)
- Global top five companies in 2023 (%)
Global Wafer-level Packaging Equipment key players include Applied Materials, Tokyo Electron, KLA-Tencor Corporation, EV Group, etc. Global top four manufacturers hold a share nearly 60%.
China Taiwan is the largest market, with a share about 30%, followed by China Mainland, and North America, both have a share about 35 percent.
In terms of product, Fan-in WLP is the largest segment, followed by Fan-out WLP, etc.
We surveyed the Wafer Level Packaging Technologies companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Level Packaging Technologies Market, by Type, 2018-2023, 2024-2030 ($ millions)
Global Wafer Level Packaging Technologies Market Segment Percentages, by Type, 2023 (%)
- Fan-In Wafer-Level Packaging
- Fan-Out Wafer-Level Packaging
Global Wafer Level Packaging Technologies Market, by Application, 2018-2023, 2024-2030 ($ millions)
Global Wafer Level Packaging Technologies Market Segment Percentages, by Application, 2023 (%)
- CMOS Image Sensor
- Wireless Connectivity
- Logic and Memory IC
- MEMS and Sensor
- Analog and Mixed IC
- Others
Global Wafer Level Packaging Technologies Market, By Region and Country, 2018-2023, 2024-2030 ($ Millions)
Global Wafer Level Packaging Technologies Market Segment Percentages, By Region and Country, 2023 (%)
- North America (USA, Canada, Mexico)
- Europe (Germany, UK, France, Russia, Italy, Rest of Europe)
- Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Rest of Asia-Pacific)
- South America (Brazil, Argentina, Columbia, Rest of South America)
- The Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria, South Africa, Rest of MEA)
Competitor Analysis
The report also provides analysis of leading market participants including:
- Key companies Wafer Level Packaging Technologies revenues in global market, 2018-2023 (estimated), ($ millions)
- Key companies Wafer Level Packaging Technologies revenues share in global market, 2023 (%)
key players include:
- Samsung Electro-Mechanics
- TSMC
- Amkor Technology
- Orbotech
- Advanced Semiconductor Engineering
- Deca Technologies
- STATS ChipPAC
- Nepes
Outline of Major Chapters:
Chapter 1: Introduces the definition of Wafer Level Packaging Technologies, market overview.
Chapter 2: Global Wafer Level Packaging Technologies market size in revenue.
Chapter 3: Detailed analysis of Wafer Level Packaging Technologies company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Wafer Level Packaging Technologies in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.
