Report overview
The surface-mount IC packages that are assembled on a PCB are available in different types. The most popular ones among these are the QFN packages.
QFN is a leadframe based, plastic encapsulated chip scale package (CSP) that provides customers with an ideal choice for many applications where size, weight and thermal and electrical performance are important. A leadless package, QFN?s electrical connections are achieved by way of lands located on the bottom side of the component to the surface of the PCB. QFN packages have proven to be successful for a number of applications such as wireless handset, power management, analog baseband and Bluetooth devices.
This report aims to provide a comprehensive presentation of the global market for Quad Flat No-leads (QFN) Package, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Quad Flat No-leads (QFN) Package. This report contains market size and forecasts of Quad Flat No-leads (QFN) Package in global, including the following market information:
Global Quad Flat No-leads (QFN) Package Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Quad Flat No-leads (QFN) Package Market Sales, 2018-2023, 2024-2029, (K Units)
Global top five Quad Flat No-leads (QFN) Package companies in 2022 (%)
The global Quad Flat No-leads (QFN) Package market was valued at US$ 2924.4 million in 2022 and is projected to reach US$ 3588.5 million by 2029, at a CAGR of 3.0% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global key players of Quad-Flat-No-Lead Packaging(QFN) include ASE(SPIL), Amkor Technology, JCET Group, Powertech Technology Inc. and Tongfu Microelectronics, etc. Top five players occupy for a share about 71%. Asia-Pacific is the largest market, with a s
We surveyed the Quad Flat No-leads (QFN) Package manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Quad Flat No-leads (QFN) Package Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Quad Flat No-leads (QFN) Package Market Segment Percentages, by Type, 2022 (%)
Air-cavity QFN
Plastic-moulded QFN
Global Quad Flat No-leads (QFN) Package Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Quad Flat No-leads (QFN) Package Market Segment Percentages, by Application, 2022 (%)
Radio Frequency Devices
Wearable Devices
Portable Devices
Others
Global Quad Flat No-leads (QFN) Package Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Quad Flat No-leads (QFN) Package Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Quad Flat No-leads (QFN) Package revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Quad Flat No-leads (QFN) Package revenues share in global market, 2022 (%)
Key companies Quad Flat No-leads (QFN) Package sales in global market, 2018-2023 (Estimated), (K Units)
Key companies Quad Flat No-leads (QFN) Package sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Amkor Technology
Texas Instruments
STATS ChipPAC Pte. Ltd
Microchip Technology Inc.
ASE Group
NXP Semiconductor
Fujitsu Ltd.
Toshiba Corporation
UTAC Group
Linear Technology Corporation
Henkel AG & Co.
Broadcom Limited
Outline of Major Chapters:
Chapter 1: Introduces the definition of Quad Flat No-leads (QFN) Package, market overview.
Chapter 2: Global Quad Flat No-leads (QFN) Package market size in revenue and volume.
Chapter 3: Detailed analysis of Quad Flat No-leads (QFN) Package manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Quad Flat No-leads (QFN) Package in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Quad Flat No-leads (QFN) Package capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
