Download Free Sample Report

The global Semiconductor Assembly Equipment market was valued at US$ 91.2 million in 2023 and is projected to reach US$ 149.8 billion by 2030, at a CAGR of 9% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

Semiconductor Assembly Equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.

This report aims to provide a comprehensive presentation of the global market for Semiconductor Assembly Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Assembly Equipment. This report contains market size and forecasts of Semiconductor Assembly Equipment in global, including the following market information:

• Global Semiconductor Assembly Equipment Market Revenue, 2018-2023, 2024-2030, ($ millions)
• Global Semiconductor Assembly Equipment Market Sales, 2018-2023, 2024-2030, (Unit)
• Global top five Semiconductor Assembly Equipment companies in 2023 (%)

The increase in application of semiconductor ICs across many segments has increased the demand for semiconductor packaging and assembly equipment. The growth in complexity of semiconductor IC designs majorly drives the market. Recently, it has been observed that there is an increase in the need for semiconductor ICs that can perform multiple functions. Consequently, vendors have developed semiconductor ICs with complex architecture to address the rise in need for multi-functional ICs. The development of complex semiconductor ICs is a critical factor that impels the market growth during the forecast period.
We surveyed the Semiconductor Assembly Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semiconductor Assembly Equipment Market, by Type, 2018-2023, 2024-2030 ($ Millions) & (Unit)
Global Semiconductor Assembly Equipment Market Segment Percentages, by Equipment Type, 2023 (%)

• Consumer Electronics
• Automotive
• Telecommunications
• Industrial
• Healthcare
• Aerospace & Defense

• MEMS (Micro-Electro-Mechanical Systems)
• SIP (System-in-Package)
• 2.5D/3D ICs
• CMOS (Complementary Metal-Oxide-Semiconductor)
• Others (e.g., GaN, SiC)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

• Key companies Semiconductor Assembly Equipment revenues in global market, 2018-2023 (Estimated), ($ millions)
• Key companies Semiconductor Assembly Equipment revenues share in global market, 2023 (%)
• Key companies Semiconductor Assembly Equipment sales in global market, 2018-2023 (Estimated), (Unit)
• Key companies Semiconductor Assembly Equipment sales share in global market, 2023 (%)

• ASM Pacific Technology
• Kulicke & Soffa Industries
• Besi
• Accrutech
• Shinkawa
• Palomar Technologies
• Hesse Mechatronics
• Toray Engineering
• West Bond
• HYBOND
• DIAS Automation

Outline of Major Chapters:
Chapter 1: Introduces the definition of Semiconductor Assembly Equipment, market overview.
Chapter 2: Global Semiconductor Assembly Equipment market size in revenue and volume.
Chapter 3: Detailed analysis of Semiconductor Assembly Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Semiconductor Assembly Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Semiconductor Assembly Equipment capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.