Download Free Sample Report

The global Test & Burn-in Socket market was valued at US$ 1268 million in 2023 and is projected to reach US$ 2066.3 million by 2030, at a CAGR of 7.2% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

There are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips. An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below). Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use.
This report aims to provide a comprehensive presentation of the global market for Test & Burn-in Socket, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Test & Burn-in Socket. This report contains market size and forecasts of Test & Burn-in Socket in global, including the following market information:

• Global Test & Burn-in Socket Market Revenue, 2018-2023, 2024-2030, ($ millions)
• Global Test & Burn-in Socket Market Sales, 2018-2023, 2024-2030, (K Units)
• Global top five Test & Burn-in Socket companies in 2023 (%)

The main Test & Burn-in Socket players include Yamaichi Electronics, Cohu, Enplas, ISC, Smiths Interconnect, etc. The top 5 Test & Burn-in Socket players account for approximately 40% of the total global market. Asia-Pacific is the largest consumer market accounting for about 62%, followed by North America and Europe. In terms of Type, test socket is the largest segment, with a share about 60%. And in terms of application, the largest application is SOC, CPU, GPU, etc, followed by memory.
We surveyed the Test & Burn-in Socket manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Test & Burn-in Socket Market, by Type, 2018-2023, 2024-2030 ($ Millions) & (K Units)
Global Test & Burn-in Socket Market Segment Percentages, by Type, 2023 (%)

• Burn-in Socket
• Test Socket

• Memory
• CMOS Image Sensor
• High Voltage
• RF
• SOC, CPU, GPU, etc.
• Other Non-Memory

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

• Key companies Test & Burn-in Socket revenues in global market, 2018-2023 (Estimated), ($ millions)
• Key companies Test & Burn-in Socket revenues share in global market, 2023 (%)
• Key companies Test & Burn-in Socket sales in global market, 2018-2023 (Estimated), (K Units)
• Key companies Test & Burn-in Socket sales share in global market, 2023 (%)

• Yamaichi Electronics
• Cohu
• Enplas
• ISC
• Smiths Interconnect
• LEENO
• Sensata Technologies
• Johnstech
• Yokowo
• WinWay Technology
• Loranger
• Plastronics
• OKins Electronics
• Ironwood Electronics
• 3M
• M Specialties
• Aries Electronics
• Emulation Technology
• Qualmax
• MJC
• Essai
• Rika Denshi
• Robson Technologies
• Translarity
• Test Tooling
• Exatron
• Gold Technologies
• JF Technology
• Advanced
• Ardent Concepts

Outline of Major Chapters:
Chapter 1: Introduces the definition of Test & Burn-in Socket, market overview.
Chapter 2: Global Test & Burn-in Socket market size in revenue and volume.
Chapter 3: Detailed analysis of Test & Burn-in Socket manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Test & Burn-in Socket in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Test & Burn-in Socket capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.