Report overview
Wafer tapes are divided into cutting tapes and abrasive tapes. Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material following wafer or module microfabrication. The tape holds the pieces of the substrate, in case of a wafer called as die, together during the cutting process, mounting them to a thin metal frame. The dies/substrate pieces are removed from the dicing tape later on in the electronics manufacturing process. Wafer back grinding tapes
This report aims to provide a comprehensive presentation of the global market for Wafer Tape, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Tape. This report contains market size and forecasts of Wafer Tape in global, including the following market information:
Global Wafer Tape Market Revenue, 2018-2023, 2024-2030, ($ millions)
Global Wafer Tape Market Sales, 2018-2023, 2024-2030, (K Units)
Global top five Wafer Tape companies in 2022 (%)
The global Wafer Tape market was valued at US$ million in 2022 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Tape for Grinding Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of Wafer Tape include Nitto, Furukawa, Sumitomo Bakelite, DENKA, SEKISUI CHEMICAL, KGK Chemical Corporation, LINTEC Corporation, Solarplus Company and Hajime Corporation, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Wafer Tape manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wafer Tape Market, by Type, 2018-2023, 2024-2030 ($ Millions) & (K Units)
Global Wafer Tape Market Segment Percentages, by Type, 2022 (%)
Tape for Grinding
Tape for Dicing
Global Wafer Tape Market, by Application, 2018-2023, 2024-2030 ($ Millions) & (K Units)
Global Wafer Tape Market Segment Percentages, by Application, 2022 (%)
BG Processes
Cutting Processes
531
Global Wafer Tape Market, By Region and Country, 2018-2023, 2024-2030 ($ Millions) & (K Units)
Global Wafer Tape Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wafer Tape revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Wafer Tape revenues share in global market, 2022 (%)
Key companies Wafer Tape sales in global market, 2018-2023 (Estimated), (K Units)
Key companies Wafer Tape sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Nitto
Furukawa
Sumitomo Bakelite
DENKA
SEKISUI CHEMICAL
KGK Chemical Corporation
LINTEC Corporation
Solarplus Company
Hajime Corporation
Vistaic Semiconductor Technology
Semiconductor Equipment Corporation
Mitsui Chemicals Tohcello
Maxell Sliontec
NDS (NPMT)
3M
Outline of Major Chapters:
Chapter 1: Introduces the definition of Wafer Tape, market overview.
Chapter 2: Global Wafer Tape market size in revenue and volume.
Chapter 3: Detailed analysis of Wafer Tape manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Wafer Tape in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Wafer Tape capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
