Report overview
EMC (Epoxy Molding Compound) is a semi-conductor encapsulant which is used in most products where semi-conductors are applied, such as general home appliances including mobile phones, refrigerators and TVs, industrial devices and vehicles. With the development of IT technology and the development of electronic products based on modern technologies, the global semi-conductor market is expanding and the EMC demand is increasing.
This report contains market size and forecasts of Epoxy Molding Compounds for Lead Frame in global, including the following market information:
Global Epoxy Molding Compounds for Lead Frame Market Revenue, 2018-2023, 2023-2030, ($ millions)
Global Epoxy Molding Compounds for Lead Frame Market Sales, 2018-2023, 2023-2030, (Tons)
Global top five Epoxy Molding Compounds for Lead Frame companies in 2022 (%)
The global Epoxy Molding Compounds for Lead Frame market was valued at million in 2022 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period 2023-2030.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million by 2030.
DIP Segment to Reach $ Million by 2030, with a % CAGR in next six years.
The global key manufacturers of Epoxy Molding Compounds for Lead Frame include Sumitomo Bakelite, Hitachi Chemical, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Kyocera, KCC, Samsung SDI and Eternal Materials, etc. In 2022, the global top five players have a share approximately % in terms of revenue.
We surveyed the Epoxy Molding Compounds for Lead Frame manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Epoxy Molding Compounds for Lead Frame Market, by Package Form, 2018-2023, 2023-2030 ($ Millions) & (Tons)
Global Epoxy Molding Compounds for Lead Frame Market Segment Percentages, by Package Form, 2022 (%)
DIP
SOP
TSOP
QFP
TQFP
LQFP
Other
Global Epoxy Molding Compounds for Lead Frame Market, by Application, 2018-2023, 2023-2030 ($ Millions) & (Tons)
Global Epoxy Molding Compounds for Lead Frame Market Segment Percentages, by Application, 2022 (%)
Integrated Circuit
Discrete Device
Others
Global Epoxy Molding Compounds for Lead Frame Market, By Region and Country, 2018-2023, 2023-2030 ($ Millions) & (Tons)
Global Epoxy Molding Compounds for Lead Frame Market Segment Percentages, By Region and Country, 2022 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Epoxy Molding Compounds for Lead Frame revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Epoxy Molding Compounds for Lead Frame revenues share in global market, 2022 (%)
Key companies Epoxy Molding Compounds for Lead Frame sales in global market, 2018-2023 (Estimated), (Tons)
Key companies Epoxy Molding Compounds for Lead Frame sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
Sumitomo Bakelite
Hitachi Chemical
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Samsung SDI
Eternal Materials
Jiangsu Zhongpeng New Material
Shin-Etsu Chemical
Hexion
Nepes
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Beijing Sino-tech Electronic Material
