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Global Quad Flat No-leads (QFN) Package Market Research Report 2023

Global Quad Flat No-leads (QFN) Package Market Research Report 2023

  • Published on : 20 December 2022
  • Pages :99
  • Report Code:SMR-7514515

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Report overview

The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2018 to 2030. by Application segment also provides consumption during the forecast period of 2018 to 2030. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
Segment by Type
Air-cavity QFN
Plastic-moulded QFN
Segment by Application
Radio Frequency Devices
Wearable Devices
Portable Devices
Others
By Company
Amkor Technology
Texas Instruments
STATS ChipPAC Pte. Ltd
Microchip Technology Inc.
ASE Group
NXP Semiconductor
Fujitsu Ltd.
Toshiba Corporation
UTAC Group
Linear Technology Corporation
Henkel AG & Co.
Broadcom Limited
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina