This report contains market size and forecasts of Copper Electroplating for IC Substrates in global, including the following market information:
- Global Copper Electroplating for IC Substrates Market Revenue, 2017-2022, 2023-2028, ($ millions)
- Global Copper Electroplating for IC Substrates Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Copper Electroplating for IC Substrates companies in 2021 (%)
The global Copper Electroplating for IC Substrates market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Acid Plating Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Copper Electroplating for IC Substrates include Heraeus, Tanaka, Sumitomo Metal Mining, MK Electron, AMETEK, MacDermid Enthone, Doublink Solders, Yantai Zhaojin Kanfort and Tatsuta Electric Wire & Cable, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Copper Electroplating for IC Substrates manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Copper Electroplating for IC Substrates Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Copper Electroplating for IC Substrates Market Segment Percentages, by Type, 2021 (%)
- Acid Plating
- Alkaline Plating
Global Copper Electroplating for IC Substrates Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Copper Electroplating for IC Substrates Market Segment Percentages, by Application, 2021 (%)
- Semiconductor 531
- PCB
- Others
Global Copper Electroplating for IC Substrates Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Copper Electroplating for IC Substrates Market Segment Percentages, By Region and Country, 2021 (%)
- North America
- US
- Canada
- Mexico
- Europe
- Germany
- France
- U.K.
- Italy
- Russia
- Nordic Countries
- Benelux
- Rest of Europe
- Asia
- China
- Japan
- South Korea
- Southeast Asia
- India
- Rest of Asia
- South America
- Brazil
- Argentina
- Rest of South America
- Middle East & Africa
- Turkey
- Israel
- Saudi Arabia
- UAE
- Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
- Key companies Copper Electroplating for IC Substrates revenues in global market, 2017-2022 (Estimated), ($ millions)
- Key companies Copper Electroplating for IC Substrates revenues share in global market, 2021 (%)
- Key companies Copper Electroplating for IC Substrates sales in global market, 2017-2022 (Estimated), (K Units)
- Key companies Copper Electroplating for IC Substrates sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
- Heraeus
- Tanaka
- Sumitomo Metal Mining
- MK Electron
- AMETEK
- MacDermid Enthone
- Doublink Solders
- Yantai Zhaojin Kanfort
- Tatsuta Electric Wire & Cable
- Kangqiang Electronics
- The Prince & Izant
- Guangzhou Sanfu New Material Technology
- Shanghai Yongsheng Auxiliary Factory
- Atotech
- Jiangsu Mengde New Material Technology
