Report overview
Hybrid bonding 3D integration technology is increasingly being utilized in various semiconductor devices such as sensors, memory, and logic to enable increased I/O density, improved electrical and mechanical performance, and reduced size and cost.
This report contains market size and forecasts of Hybrid Bonding Technology in Global, including the following market information:
Global Hybrid Bonding Technology Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global Hybrid Bonding Technology market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Cu-Cu Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Hybrid Bonding Technology include EV Group, Intel, SkyWater, Applied Materials, SUSS, Xperi and LAPIS and Huawei, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Hybrid Bonding Technology companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Hybrid Bonding Technology Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Hybrid Bonding Technology Market Segment Percentages, by Type, 2021 (%)
Cu-Cu
Cu-SiO2
Others
Global Hybrid Bonding Technology Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global Hybrid Bonding Technology Market Segment Percentages, by Application, 2021 (%)
Sensors
Memory
Logic
Others
Global Hybrid Bonding Technology Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global Hybrid Bonding Technology Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Hybrid Bonding Technology revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Hybrid Bonding Technology revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
EV Group
Intel
SkyWater
Applied Materials
SUSS
Xperi and LAPIS
Huawei
