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Low profile electrolytic copper foil has excellent physical properties of equiaxed fine grain, low profile, high strength and high elongation. It is mainly used for multilayer printed circuit boards and high-density circuit boards. It requires that the surface roughness of copper foil is smaller than that of ordinary copper foil, and the properties such as anti-peeling strength are maintained at a high level. Electrolytic copper foil.
This report contains market size and forecasts of Low Profile Electrolytic Copper Foil in global, including the following market information:

• Global Low Profile Electrolytic Copper Foil Market Revenue, 2017-2022, 2023-2028, ($ millions)
• Global Low Profile Electrolytic Copper Foil Market Sales, 2017-2022, 2023-2028, (K Tons)
• Global top five Low Profile Electrolytic Copper Foil companies in 2021 (%)

The global Low Profile Electrolytic Copper Foil market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Below 15 m Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Low Profile Electrolytic Copper Foil include Mitsui Mining & Smelting, FUKUDA METAL FOIL & POWDER, Furukawa Electric, Doosan, Nisshin Materials, Nanya New Material Technology, Chang Chun Group, LCY TECHNOLOGY CORP and Anhui Tongguan Copper Foil Group, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Low Profile Electrolytic Copper Foil manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Low Profile Electrolytic Copper Foil Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Tons)
Global Low Profile Electrolytic Copper Foil Market Segment Percentages, by Type, 2021 (%)

• Below 15 m
• 15 m-40 m
• Above 40 m

Global Low Profile Electrolytic Copper Foil Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Tons)
Global Low Profile Electrolytic Copper Foil Market Segment Percentages, by Application, 2021 (%)

• Automobile Industry
• Power Industry
• Military Industry
• Aerospace Industry
• Others

Global Low Profile Electrolytic Copper Foil Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Tons)
Global Low Profile Electrolytic Copper Foil Market Segment Percentages, By Region and Country, 2021 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

Competitor Analysis
The report also provides analysis of leading market participants including:

• Key companies Low Profile Electrolytic Copper Foil revenues in global market, 2017-2022 (Estimated), ($ millions)
• Key companies Low Profile Electrolytic Copper Foil revenues share in global market, 2021 (%)
• Key companies Low Profile Electrolytic Copper Foil sales in global market, 2017-2022 (Estimated), (K Tons)
• Key companies Low Profile Electrolytic Copper Foil sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

• Mitsui Mining & Smelting
• FUKUDA METAL FOIL & POWDER
• Furukawa Electric
• Doosan
• Nisshin Materials
• Nanya New Material Technology
• Chang Chun Group
• LCY TECHNOLOGY CORP
• Anhui Tongguan Copper Foil Group
• Jiangxi Copper Yates Copper Foil
• Jiujiang Defu Technology
• Kinpo Electronics
• CNEN Metal Materials (Shanghai)
• Shenzhen Londian Wason Holdings Group
• Kingboard Copper Foil Holdings Limited
• Nuode Investment