Report overview
Direct Copper-Plated Ceramic Substrate is the newest development in the field of Ceramic Substrate PCBs and using this method can result in copper thickness' ranging from 10um (? 1/3oz) to 140um (4oz). With Direct Copper-Plated track printing and etching is then performed with the thin Copper allowing for very fine tracks and reduced undercutting.
This report contains market size and forecasts of Direct Copper-Plated Ceramic Substrate in global, including the following market information:
Global Direct Copper-Plated Ceramic Substrate Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Direct Copper-Plated Ceramic Substrate Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Direct Copper-Plated Ceramic Substrate companies in 2021 (%)
The global Direct Copper-Plated Ceramic Substrate market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Al?O? Ceramic Substrate Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Direct Copper-Plated Ceramic Substrate include Tong Hsing, ICP Technology, Ecocera, Tensky (Xellatech), Maruwa, Ceratron Electric, Ferrotec, Folysky Technology(Wuhan) and Wuhan Lizhida Technology, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Direct Copper-Plated Ceramic Substrate manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Direct Copper-Plated Ceramic Substrate Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Direct Copper-Plated Ceramic Substrate Market Segment Percentages, by Type, 2021 (%)
Al?O? Ceramic Substrate
AlN Ceramic Substrate
Global Direct Copper-Plated Ceramic Substrate Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Direct Copper-Plated Ceramic Substrate Market Segment Percentages, by Application, 2021 (%)
High-Brightness LED
Laser and Optical Communication
TEC
High Temperature Sensors
Others
Global Direct Copper-Plated Ceramic Substrate Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Direct Copper-Plated Ceramic Substrate Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Direct Copper-Plated Ceramic Substrate revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Direct Copper-Plated Ceramic Substrate revenues share in global market, 2021 (%)
Key companies Direct Copper-Plated Ceramic Substrate sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Direct Copper-Plated Ceramic Substrate sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Tong Hsing
ICP Technology
Ecocera
Tensky (Xellatech)
Maruwa
Ceratron Electric
Ferrotec
Folysky Technology(Wuhan)
Wuhan Lizhida Technology
Zhuhai Hanci Jingmi
Meizhou Zhanzhi Electronic Technology
Huizhou Xinci Semiconductor
Yiyang Smuyang Electronic Technology
Shenzhen Yuan Xuci Electronic Technology
Bomin Electronics
Suzhou GYZ Electronic Technology
