Report overview
Non-Lead Package Leadframe is a metal structure inside a chip package that is used to pass signals from the die to the outside. Specialized gates are designed for reliability at today's lead-free circuit assembly temperatures.
This report contains market size and forecasts of Non-Lead Package Leadframe in global, including the following market information:
Global Non-Lead Package Leadframe Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Non-Lead Package Leadframe Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Non-Lead Package Leadframe companies in 2021 (%)
The global Non-Lead Package Leadframe market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Stamping Process Lead Frame Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Non-Lead Package Leadframe include SHINKO, DNP, Mitsui High-tec, Advanced Assembly Materials International, HAESUNG DS, SDI Electronic, Possehl Electronics, Dynacraft Industries and QPL Limited, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Non-Lead Package Leadframe manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Non-Lead Package Leadframe Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Non-Lead Package Leadframe Market Segment Percentages, by Type, 2021 (%)
Stamping Process Lead Frame
Etching Process Lead Frame
Global Non-Lead Package Leadframe Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Non-Lead Package Leadframe Market Segment Percentages, by Application, 2021 (%)
Integrated Circuit
Discrete Device
Others
Global Non-Lead Package Leadframe Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Non-Lead Package Leadframe Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Non-Lead Package Leadframe revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Non-Lead Package Leadframe revenues share in global market, 2021 (%)
Key companies Non-Lead Package Leadframe sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Non-Lead Package Leadframe sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
SHINKO
DNP
Mitsui High-tec
Advanced Assembly Materials International
HAESUNG DS
SDI Electronic
Possehl Electronics
Dynacraft Industries
QPL Limited
Chang Wah Technology
Fusheng Electronics
