Report overview
Multi-wire cutting is a cutting method that simultaneously cuts hard and brittle materials such as semiconductors into hundreds of thin slices through high-speed reciprocating motion of diamond wire wound on the main shaft.
This report contains market size and forecasts of Silicon Wafer Multi Wire Cutting Machine in global, including the following market information:
Global Silicon Wafer Multi Wire Cutting Machine Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Silicon Wafer Multi Wire Cutting Machine Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Silicon Wafer Multi Wire Cutting Machine companies in 2021 (%)
The global Silicon Wafer Multi Wire Cutting Machine market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Line Speed Below 600m/min Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Silicon Wafer Multi Wire Cutting Machine include Takatori, Meyer Burger, Komatsu NTC, DISCO and Hunan Yujing Machinery, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Silicon Wafer Multi Wire Cutting Machine manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Silicon Wafer Multi Wire Cutting Machine Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Silicon Wafer Multi Wire Cutting Machine Market Segment Percentages, by Type, 2021 (%)
Line Speed Below 600m/min
Line Speed 600m/min-1200m/min
Line Speed 1200m/min-1800m/min
Line Speed Above 1800m/min
Global Silicon Wafer Multi Wire Cutting Machine Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Silicon Wafer Multi Wire Cutting Machine Market Segment Percentages, by Application, 2021 (%)
Semiconductor
Photovoltaic
Global Silicon Wafer Multi Wire Cutting Machine Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Silicon Wafer Multi Wire Cutting Machine Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Silicon Wafer Multi Wire Cutting Machine revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Silicon Wafer Multi Wire Cutting Machine revenues share in global market, 2021 (%)
Key companies Silicon Wafer Multi Wire Cutting Machine sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Silicon Wafer Multi Wire Cutting Machine sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Takatori
Meyer Burger
Komatsu NTC
DISCO
Hunan Yujing Machinery
