Report overview
Copper electroplating is a critical step in the fabrication of reliable High Density Interconnect (HDI) substrates intended for use as core layers in build-up applications. HDI substrates may contain vias and through holes having several different dimensions that make it challenging to meet via filling and hole throwing power (TP) requirements. A next generation Electrolytic Copper plating process was developed to fill blind micro vias and provide good TP in through holes to meet the demands of this market. Void-free bottom-up fill in via features with higher throwing power in through holes is achieved with this novel Direct Current (DC) copper electroplating product. The copper via fill plating bath is formulated with novel additives to operate over a wide range of operating conditions.
This report contains market size and forecasts of Electrolytic Copper Plating for HDI in Global, including the following market information:
Global Electrolytic Copper Plating for HDI Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global top five companies in 2021 (%)
The global Electrolytic Copper Plating for HDI market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Panel Plating Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Electrolytic Copper Plating for HDI include DuPont, Atotech, NCAB Group, MacDermid Alpha Electronics Solutions, ICAPE Group, RUSH PCB, MOKO Technology, Schl?tter and IPCB Circuits Limited and etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Electrolytic Copper Plating for HDI companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Electrolytic Copper Plating for HDI Market, by Type, 2017-2022, 2023-2028 ($ millions)
Global Electrolytic Copper Plating for HDI Market Segment Percentages, by Type, 2021 (%)
Panel Plating
Legend Plating
Global Electrolytic Copper Plating for HDI Market, by Application, 2017-2022, 2023-2028 ($ millions)
Global Electrolytic Copper Plating for HDI Market Segment Percentages, by Application, 2021 (%)
Manufacturing HDI
Repair HDI
Global Electrolytic Copper Plating for HDI Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions)
Global Electrolytic Copper Plating for HDI Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Electrolytic Copper Plating for HDI revenues in global market, 2017-2022 (estimated), ($ millions)
Key companies Electrolytic Copper Plating for HDI revenues share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
DuPont
Atotech
NCAB Group
MacDermid Alpha Electronics Solutions
ICAPE Group
RUSH PCB
MOKO Technology
Schl?tter
IPCB Circuits Limited
Bobebo
