Report overview
This report contains market size and forecasts of Electrodeposited Copper Foil for Printed Circuit Boards in global, including the following market information:
Global Electrodeposited Copper Foil for Printed Circuit Boards Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Electrodeposited Copper Foil for Printed Circuit Boards Market Sales, 2017-2022, 2023-2028, (Kiloton)
Global top five Electrodeposited Copper Foil for Printed Circuit Boards companies in 2021 (%)
The global Electrodeposited Copper Foil for Printed Circuit Boards market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period 2022-2028.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Below 20 ?m Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Electrodeposited Copper Foil for Printed Circuit Boards include Mitsui Mining & Smelting, JX Nippon Mining & Metals, Jiangxi Copper, Furukawa Electric, Nan Ya Plastics, Arcotech, Kingboard Copper Foil, Guangdong Chaohua Technology and Ls Mtron, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Electrodeposited Copper Foil for Printed Circuit Boards manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Electrodeposited Copper Foil for Printed Circuit Boards Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (Kiloton)
Global Electrodeposited Copper Foil for Printed Circuit Boards Market Segment Percentages, by Type, 2021 (%)
Below 20 ?m
20-50 ?m
Above 50 ?m
Global Electrodeposited Copper Foil for Printed Circuit Boards Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (Kiloton)
Global Electrodeposited Copper Foil for Printed Circuit Boards Market Segment Percentages, by Application, 2021 (%)
Single Sided Board
Double Sided Board
Multi Layered Board
Global Electrodeposited Copper Foil for Printed Circuit Boards Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (Kiloton)
Global Electrodeposited Copper Foil for Printed Circuit Boards Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Electrodeposited Copper Foil for Printed Circuit Boards revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Electrodeposited Copper Foil for Printed Circuit Boards revenues share in global market, 2021 (%)
Key companies Electrodeposited Copper Foil for Printed Circuit Boards sales in global market, 2017-2022 (Estimated), (Kiloton)
Key companies Electrodeposited Copper Foil for Printed Circuit Boards sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Mitsui Mining & Smelting
JX Nippon Mining & Metals
Jiangxi Copper
Furukawa Electric
Nan Ya Plastics
Arcotech
Kingboard Copper Foil
Guangdong Chaohua Technology
Ls Mtron
Chang Chun Petrochemical
Minerex
Circuit Foil Luxembourg
Suzhou Fukuda Metal
LingBao Wason Copper Foil
Targray Technology International
Shandong Jinbao Electronics
