Thermal Interface Material for 5G market is segmented by Type and by Application. Players, stakeholders, and other participants in the global Thermal Interface Material for 5G market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
Thermal Pad
Thermal Gel
Thermal Grease
Thermal Tap
Graphite Sheet
Phase Change Material
Thermal Gap Filler
Others (Graphene, Carbon Fiber TIM)
Segment by Application
5G Smartphone
5G Base Station
Others (Routers and Servers)
By Company
Fuji Polymer Industries Co., Ltd.
Laird Technologies, Inc.
Henkel Corporation
Dow
W.L. Gore and Associates, Inc.
Panasonic Corporation
Jiangxi Dasen Technology Co., Ltd.
3M Company
Shin-Etsu Chemical Co., Ltd.
Denka Company Limited
JONES TECH PLC
Parker Hannifin Corp
Momentive Performance Materials, Inc.
Dongguan Sheen Electronic Technology Co., Ltd.
T-Global Technology Co., Ltd.
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
