Alumina Thick Film Substrates market is segmented by Type and by Application. Players, stakeholders, and other participants in the global Alumina Thick Film Substrates market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
- Thickness: 0.1mm-1mm
- Thickness: 1mm-2mm
- Thickness: 2mm-3mm
- Others
Segment by Application
- Printed Substrates for Automotive Parts
- Printed Substrates for Sensor Parts
- Substrate for Chip Resistors
- LED Package
- HIC Substrates for Heat Dissipation
- Others
By Company
- Maruwa(Japan)
- Tong Hsing(Taiwan)
- Kyocera(Japan)
- Leatec Fine Ceramics(Taiwan)
- Holy Stone(Taiwan)
- Nikko(Japan)
- CoorsTek(US)
- NCI(Japan)
- Miyoshi Electronics(Japan)
- NEO Tech(US)
- Anaren(US)
- Micro Systems Engineering GmbH(Germany)
- Micro-Precision Technologies(US)
- Remtec(US)
- ELCERAM(Czech)
- KERAFOL Keramische Folien GmbH(Germany)
- Best Technology(China)
- Noritake (Japan)
- Mitsuboshi Belting (Japan)
Production by Region
- North America
- Europe
- China
- Japan
- South Korea
Consumption by Region
- North America
- United States
- Canada
- Europe
- Germany
- France
- U.K.
- Italy
- Russia
- Asia-Pacific
- China
- Japan
- South Korea
- India
- Australia
- China Taiwan
- Indonesia
- Thailand
- Malaysia
- Latin America
- Mexico
- Brazil
- Argentina
- Middle East & Africa
- Turkey
- Saudi Arabia
- UAE
