Thick Copper Foil for Heat Sink and Current Board market is segmented by Type and by Application. Players, stakeholders, and other participants in the global Thick Copper Foil for Heat Sink and Current Board market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
105 ?m-200 ?m
200 ?m-300 ?m
300 ?m-400 ?m
Above 400 ?m
Segment by Application
Various Heat Sink
High Current Board
By Company
Fukuda Metal Foil & Powder
Mitsui Mining & Smelting
The Furukawa Electric
JX Nippon Mining & Metals
HuiZhou United Copper Foil Electronic Material
Doosan Electronic(Luxembourg Circuit Copper Foil)
Gould Electronics
Taiyo Kogyo Corporation
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
