Report overview
Wire Bonding Equipment is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the time of chip packaging. The thin-wire is used to make these connections that are generally made of gold, copper, aluminum or silver.
This report contains market size and forecasts of Wire Bonding Equipment in global, including the following market information:
Global Wire Bonding Equipment Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Wire Bonding Equipment Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five Wire Bonding Equipment companies in 2021 (%)
The global Wire Bonding Equipment market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Manual Wire Bonding Equipment Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Wire Bonding Equipment include Kulicke & Soffa (K&S), ASM Pacific Technology, TPT, Hesse Mechatronics, West Bond, Hybond, KAIJO Corporation, Questar Products and Anza Technology, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
We surveyed the Wire Bonding Equipment manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Wire Bonding Equipment Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Wire Bonding Equipment Market Segment Percentages, by Type, 2021 (%)
Manual Wire Bonding Equipment
Semi-Automatic Wire Bonding Equipment
Fully-Automatic Wire Bonding Equipment
Global Wire Bonding Equipment Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Wire Bonding Equipment Market Segment Percentages, by Application, 2021 (%)
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
Global Wire Bonding Equipment Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Wire Bonding Equipment Market Segment Percentages, By Region and Country, 2021 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Wire Bonding Equipment revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Wire Bonding Equipment revenues share in global market, 2021 (%)
Key companies Wire Bonding Equipment sales in global market, 2017-2022 (Estimated), (K Units)
Key companies Wire Bonding Equipment sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
Kulicke & Soffa (K&S)
ASM Pacific Technology
TPT
Hesse Mechatronics
West Bond
Hybond
KAIJO Corporation
Questar Products
Anza Technology
F&K Delvotec Bondtechnik
Shinkawa
Palomar Technologies
Micro Point Pro Ltd (MPP)
Planar Corporation
Mech-El Industries Inc.
Ultrasonic Engineering
