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Glass substrate is a thin glass board on which a thin circuit is deposited with precision. This report will research the application in semiconductor packaging.
This report contains market size and forecasts of Glass Substrate for Semiconductor Packaging in global, including the following market information:

• Global Glass Substrate for Semiconductor Packaging Market Revenue, 2017-2022, 2023-2028, ($ millions)
• Global Glass Substrate for Semiconductor Packaging Market Sales, 2017-2022, 2023-2028, (K Units)
• Global top five Glass Substrate for Semiconductor Packaging companies in 2021 (%)

The global Glass Substrate for Semiconductor Packaging market was valued at million in 2021 and is projected to reach US$ million by 2028, at a CAGR of % during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Cover Glass Substrate Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Glass Substrate for Semiconductor Packaging include Schott AG, Tecnisco, Plan Optik AG, AGC and Corning, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Glass Substrate for Semiconductor Packaging manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Glass Substrate for Semiconductor Packaging Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global Glass Substrate for Semiconductor Packaging Market Segment Percentages, by Type, 2021 (%)

• Cover Glass Substrate
• Back-grinding Glass Substrate
• Support Glass Substrate
• Others

Global Glass Substrate for Semiconductor Packaging Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Glass Substrate for Semiconductor Packaging Market Segment Percentages, by Application, 2021 (%)

• Wafer Level Packaging
• Panel Level Packaging
• Others

Global Glass Substrate for Semiconductor Packaging Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)

Global Glass Substrate for Semiconductor Packaging Market Segment Percentages, By Region and Country, 2021 (%)

• North America
• US
• Canada
• Mexico
• Europe
• Germany
• France
• U.K.
• Italy
• Russia
• Nordic Countries
• Benelux
• Rest of Europe
• Asia
• China
• Japan
• South Korea
• Southeast Asia
• India
• Rest of Asia
• South America
• Brazil
• Argentina
• Rest of South America
• Middle East & Africa
• Turkey
• Israel
• Saudi Arabia
• UAE
• Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

• Key companies Glass Substrate for Semiconductor Packaging revenues in global market, 2017-2022 (Estimated), ($ millions)
• Key companies Glass Substrate for Semiconductor Packaging revenues share in global market, 2021 (%)
• Key companies Glass Substrate for Semiconductor Packaging sales in global market, 2017-2022 (Estimated), (K Units)
• Key companies Glass Substrate for Semiconductor Packaging sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:

• Schott AG
• Tecnisco
• Plan Optik AG
• AGC
• Corning