PCB for 5G market is segmented by Type and by Application. Players, stakeholders, and other participants in the global PCB for 5G market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
Single Panel
Double Panel
Multilayer Panel
Segment by Application
Smart Phone
Consumer Electronics
Automobile Electronics
Communications Electronics
Others
By Company
Ibiden
Nippon Mektron
Samsung Electro-Mechanics
Tripod Technology
TTM Technologies
Unimicron Technology
Young Poong Electronics
Zhen Ding Technology Holding
CMK
Daeduck Electronics
Hannstar Board Technology
Kingboard Chemical Holdings
Multek
Nan Ya Printed Circuit Board
Production by Region
North America
Europe
China
Japan
South Korea
Taiwan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
